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CHIPMOS
关于 ChipMOS - ChipMOS台湾公司主要从事集成电路（IC）封装和测试业务。公司主要提供薄型小外形封装（TSOP），细间距球栅阵列（FBGA）封装，带载封装（TCP）和芯片上薄膜（COF）封装服务，以及金凸点服务等。该公司的产品和服务应用于信息产品，个人计算机，通信设备，办公自动化和消费电子产品。它主要在国内市场和海外市场（包括亚洲和美洲其他地区）开展业务。
ChipMOS TECHNOLOGIES INC。研究，开发，制造高集成度和高精度集成电路，以及相关组装和测试服务。它提供一系列后端组装和测试服务，包括工程测试，晶圆探测和存储器和逻辑/混合信号半导体的最终测试，以及用于存储器和逻辑的引线框架和有机基板封装组装服务/混合信号半导体;和金色凸点，卷轴到卷轴组件，以及LCD和其他平板显示器驱动半导体的测试服务。该公司的半导体用于个人电脑;图形应用程序，例如游戏控制台;通讯设备;包括蜂窝手机，平板电脑和消费电子产品的移动产品;和汽车/工业和显示器应用，例如平板显示器。它为台湾，日本，韩国，香港和美国的客户提供服务。该公司成立于1997年，总部位于台湾新竹。
关于 ChipMOS - ChipMOS Taiwan-based company principally engaged in the integrated circuits (IC) packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Company's products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. It mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures high integration and high precision integrated circuits, and related assembly and testing services. It provides a range of back-end assembly and test services, including engineering test, wafer probing and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other flat-panel display driver semiconductors. The company's semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as flat-panel displays. It serves customers in Taiwan, Japan, Korea, Hong Kong, and the United States. The company was founded in 1997 and is headquartered in Hsinchu, Taiwan.
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